IBM is once again developing another revolutionary product in the name of tech. It’s got a pretty technical name ever called VTFET
IBM and Samsung had announced a week ago their new concept that could allow transistors in a chip to be stacked vertically instead of the usual way: transistors lying down on a surface flat of the semiconductor. This tech is called VTFET, an acronym for Vertical Transport Field Effect Transistor.
VTFET is supposed to be the successor of the mainstream FinFET (Fin Field Transport Effect Transistor) manufacturing process currently used for chipsets in smartphones. VTFET allows for an even denser packing than FinFET because the transistors are packed vertically instead of horizontally.
IBM claims that VTFET can save 85% more energy than FinFET. VTFET was also developed alongside IBM’s 2nm chip concept last May that could allow a chip to fit at least 50 billion transistors “at a size of a fingernail”.
While VTFET is still more of a concept than an actual tech that could be mass-produced, it goes to show that companies are still willing to go up and beyond in further improving lives and technology. Going upwards is possibly the only way chips can go as well, as currently what we can do with them is their continued shrinking.
IBM and Samsung had cited a few ways this new tech could be useful, most notably, the idea that a phone could go over a week without charging. Another use is less-intrusive cryptocurrency mining and/or data encryption, as well as the development of even more powerful IoT devices.