IBM: Are you challenging me?
MediaTek and TSMC announced its first 3nm chipset, a move that makes MediaTek, and particularly, TSMC, a global leader in innovating new mobile chipsets. Though, this is quite impressive, it’s not so impressive as what IBM is cooking.
However, unlike the latter, this new 3nm chipset is set for mass production starting in the latter half of 2024. The chipset will be set under the Dimensity series and if we’re following their naming scheme, it’s most likely that this will be named the Dimensity 9500 5G.
“We are committed to our vision of using the world’s most advanced technology to create cutting edge products that improve our lives in meaningful ways,” said Joe Chen, President of MediaTek. “TSMC’s consistent and high-quality manufacturing capabilities enable MediaTek to fully demonstrate its superior design in flagship chipsets, offering the highest performance and quality solutions to our global customers and enhancing the user experience in the flagship market.”
“This collaboration between MediaTek and TSMC on MediaTek’s Dimensity SoC means the power of the industry’s most advanced semiconductor process technology can be as accessible as the smartphone in your pocket,” said Dr. Cliff Hou, Senior Vice President of Europe and Asia Sales at TSMC. “Throughout the years, we have worked closely with MediaTek to bring numerous significant innovations to the market and are honored to continue our partnership into the 3nm generation and beyond.“
According to the company, the chipset is very flexible and is capable of powering both computers and smartphones. In comparison to TSMC’s N5 process, this new 3nm technology offers “as much as 18% speed improvement at the same power”, or 32% power reduction at the same speed, and approximately 60% increase in logic density, or in simple terms, the new process makes AI processing much smarter and much more efficient.
Aside from phones, MediaTek said that this 3nm technology will power tablets, intelligent cars, and other smart devices.