CES 2023: MediaTek further demonstrates its Wi-Fi 7 solution and unveils the Genio 700 IoT chip

Companies are going full-on showman at CES 2023. Crazy what an event makes companies do.

Two things happened with MediaTek during this year’s CES event. The first is the unveiling of the company’s first
Wi-Fi 7 technology (and remember, they were one of the first to showcase this improved Wi-Fi connectivity) and the other is a chipset intended for your cute little vacuum robots, TVs, lightbulbs, and others.

Just like newer MediaTek chipsets for smartphones, the Genio 700 is a 6nm chipset composed of two Arm Cortex-A78 performance cores clocked at 2.2GHz and six Arm Cortex-A55 power efficiency cores clocked at 2GHz. This midrange IOT chip also has a 4.0TOPS AI accelerator. It also supports up to 4K@60fps displays.

“When we launched the Genio family of IoT products last year, we designed the platform with the scalability and development support that brands need, paving the way for opportunities to continue expanding,” said Richard Lu, Vice President of MediaTek IoT Business Unit. “With a focus on industrial and smart home products, the Genio 700 is a perfect natural addition to the lineup to ensure we can provide the widest range of support possible to our customers.”

Among other features, the Genio 700 supports high-speed interfaces including PCIe 2.0, USB 3.2 Gen 1, and MIPI-CSI camera interface. It can also decode both the standard H.264 codec as well as a higher-res H.265 codec with support for dual display (FHD@60fps + 4K@60fps).

As for the other, Wi-Fi 7, MediaTek said that this improves upon Wi-Fi 6/6E by integrating a record-breaking 320MHz channel bandwidth and 4096-QAM modulation that creates a seamless internet experience. MediaTek previously demonstrated their Wi-Fi 7 tech last year.

“Last year, we gave the world’s first Wi-Fi 7 technology demonstration, and we are honored to now show the significant progress we have made in building a more complete ecosystem of products,” said Alan Hsu, corporate vice president and general manager of the Intelligent Connectivity Business unit at MediaTek. “This lineup of devices, many of which are powered by the CES 2023 Innovation Award-winning Filogic 880 flagship chipset, illustrates our commitment to providing the best wireless connectivity.”

MediaTek’s Wi-Fi 7 solution involved the 6nm Filogic 880 flagship Wi-Fi chip. MediaTek also boasts a 50% reduction in power consumption in comparison to Wi-Fi 6 technology, a 25x reduction in CPU utilization, and 100x lower MLO switch latency when compared to competing options. There’s also a 4T5R penta-band mesh that allows it to have a longer, father range.

This new demonstration was achieved by combining the company’s Filogic chips to Wi-Fi 7 access points from broadband operators, enterprise markets, and retail router channels. In particular, the flagship Filogic 380 was used to demonstrate how Wi-Fi 7 is designed to bring a fast and reliable connectivity to all possible Wi-Fi devices like smartphones, laptops, desktops, TVs, and streaming devices.

In particular, companies like AMD, Lenovo, ASUS, TP-Link, BUFFALO, Korea Telecom, HiSense, and Qorvo all expressed interest in bringing MediaTek’s Wi-Fi 7 technology to their products. Lenovo even hinted that this new tech will appear on newer Legion devices.

“MediaTek’s vision for excellence in Wi-Fi connectivity mirrors our own commitment to empowering gamers with immersive, high-performance PC gaming experiences, and we look forward to collaborating together to bring MediaTek’s Wi-Fi 7 technology to upcoming Lenovo Legion devices.” said Ouyang Jun, Vice President and General Manager of Consumer Business Segment, Lenovo’s Intelligent Device Group.

In a nutshell, MediaTek is innovative and definitely a leader in the tech industry. Your move, red team.