The Mediatek Dimensity 1050 brings mmWave support for midrange phones. In addition, the Mediatek Dimensity 930 and Helio G99 have also been released


Is this a response to the Qualcomm Snapdragon 7 Gen 1?

With Qualcomm’s jaw-dropping Snapdragon 7 Gen 1 chipset with a 4nm process, Mediatek has to respond and compete that could deliver blows to it in terms of performance. Oh boy, Mediatek is very serious in this competition because they just have released three chipsets all in the span of one day. That number one position must not be overtaken! Two of these support 5G (with the Dimensity 1050 supporting mmWaves) and one of it is a budget midrange chipset based on a 6nm process.

Let’s discuss first the 1050, the company’s main highlight.

MEDIATEK DIMENSITY 1050

The Mediatek Dimensity 1050 is a 5G chipset based on a 6nm TSMC process. Its main highlight is bringing 5G mmWaves for midrangers that allows smartphones to quickly and seamlessly connect and switch to sub-6GHz and/or 5G mmWave standards. This in turn allows for smoother and faster internet speeds especially in highly populated areas.

The chipset has an octa-core CPU consisting of two Cortex-A78 CPUs clocked at 2.5GHz along with a Mali-G610 GPU. It supports UFS 3.1 storage and LPDDR5 RAM. This chipset is meant to contest the Snapdragon 7 Gen 1 which was recently released, although that one has a slightly more efficient 4nm process.

Mediatek claims that the Dimensity 1050 can deliver up to 53% faster connectivity in comparison to just LTE + mmWave alone. In addition to combining sub-6GHz and mmWave standards, Mediatek has also implemented Wi-Fi optimizations to further make connectivity smoother and consistent. It also features Mediatek’s HyperEngine 5.0 that ensures low-latency gaming with a new triple-band 2.4GHz, 5GHz, and 6GHz Wi-Fi. It also supports Wi-Fi 6/6E connectivity.

For displays, the chipset could support FHD+ displays of up to 144Hz refresh rates as well as 10-bit color, Dolby Vision, and HDR10. The new chipset also brings the Intelligent Display Sync that improves power effiency and thus reduce the power demands of the displays especially on stand-by.

The Mediatek Imagiq 760 ISP brings improvements to camera processing especially in low light. It supports cameras of up to 108MP as well as dual HDR video capture. The image processing improvements are all possible thanks to the new Mediatek 550 AI Processing Unit.

If you could recall, the company has previously introduced Wi-Fi 7 connectivity through the Filogic 880 and Filogic 380 modems. Mediatek promises to bring devices with the Dimensity 1050 powering them as early as Q3 2022. As of this writing, no devices have been confirmed to use the chipset.

In addition, Mediatek has also introduced the Dimensity 930 and Helio G99 for lower-end devices. The Helio G99 does not have 5G connectivity but makes up for it by delivering powerful performance down to lower midrange phones.

The Mediatek Dimensity 930 is essentially an overclocked Dimensity 920 and is designed with faster and smoother connectivity in mind as well as improving displays. The MiraVision HDR video playback, HDR10+ video support, and 120Hz FHD+ display support allow for this to be possible. Additionally, the HyperEngine 3.0 Lite makes gaming smoother while maintaining FPS so it does not drop. It brings about improved power efficiency while gaming and intelligent multi-network management to ensure lower latency while continuously playing intense online games and maximizing battery life.

EDIT: We got confirmations about the GPU it uses, the IMG BXM B-256 paired with an octa-core CPU comprising of two Cortex-A78 power cores clocked at 2.2GHz and six Cortex-A55 efficiency cores clocked at 2GHz. This new GPU was manufactured by the same company famous for the PowerVR GPU, Imagination Technologies.

Meanwhile, the Mediatek Helio G99 is a chipset designed for performance. It improves upon the Helio G96 by bringing a more efficient 6nm process. Other than this, the chipset comes with the usual specs available for the Helio G96, that is UFS 2.2 storage support, LPDDR4X RAM support, and an octa-core CPU consisting of two Cortex-A76 cores clocked at 2.2GHz, and six Cortex-A55 efficiency cores clocked at 2.0GHz complemented with a Mali-G57 MC2 GPU. It is a 4G-only chipset. It would be available for manufacturers to use starting Q2 2022.