Oppo Reno 6 and Reno 6 Pro to feature Dimensity chipsets, appears on TENAA

Pictured: Oppo Reno 5 5G, Courtesy of: Oppo

It’s been nearly 6 months since the release of the Oppo Reno 5 series, and now there have been leaks on the Reno 6 series, including the Pro version and the Pro+ version.

Oppo has been reportedly working on three smartphones with the following model numbers: PEQM00 (Reno 6), PEPM00 (Reno 6 Pro) and PENM00 (Reno 6 Pro+).

A post from a reliable tipster in Weibo (via Twitter)said that the Reno 6 may be equipped with an all-new Mediatek Dimensity chipset, the Dimensity 900, and the Pro version will be equipped with a Dimensity 1200 chipset. Both of these are 5G capable. The Dimensity 900 is said to perform better than the Qualcomm Snapdragon 768G.

In AnTuTu, the Reno 6 Pro with model number PEPM00 scored an average 713731 points. Although the chipset in question was not mentioned, it is still pretty much possible that the phone is powered by a Dimensity 1200 chipset due to the score.

In addition to the AnTuTu score, the Reno 6 Pro also appeared on TENAA, with full specifications included. The spec sheet included a FHD+ screen with a resolution of 1080×2400 pixels, a 3GHz processor, possibly the Dimensity 1200 chipset, and possibly, two RAM and storage options, which are 8 and 12GB RAM with 128 and 256GB storage.

The Reno 6 Pro+ (PENM00) also appeared on TENAA. Some of the rumoured specs include a Snapdragon 870 chipset, 4500mAh dual-cell battery with 65W fast charging, and for photography, comes with a quad camera system: 50mp + 16mp + 13mp + 2mp. For the front camera, it is said to come with a punch-hole 32mp selfie cam.

There is no exact spec sheet for the vanilla Reno 6 than the new Dimensity 900 chipset, which appears to be an uptiered Dimensity 800 chipset. We will update for any official announcement. There are rumours stating that these three phones will launch in China on 22nd May.

Source: Weibo (in Chinese) via Gizmochina, GizmoChina (TENAA)