UNISOC announced its revamped line of 5G chipsets, named “Tanggula” after the Tanggula Mountains in China.
The new line is classified into four series: Tanggula 6, Tanggula 7, Tanggula 8 and Tanggula 9.
Tanggula 6 is an entry-level chipset, possibly similar in performance as the Snapdragon 480. The Tanggula 7 is a budget midrange, similar to the Helio G70 in performance. The Tanggula 8 is a upper midrange chipset, possibly in the line of the Snapdragon 600 or 700 series, and the Tanggula 9 which aims to challenge Mediatek’s Dimensity series as well as the Snapdragon 800 series.
Currently, there are three chipsets announced for the Tanggula 7 series, below are their comparisons:
In addition, UNISOC said that the T770 will enter mass production this July. Among other plans the company has is AR technology and will co-develop AR Glasses with HiScene, however there were no announced release for the glasses. It could remain a concept as far as we know.
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