Mediatek introduces the Genio 1200 Chip for AIoT devices!

It also introduced its new AIoT platform stack

Mediatek has recently announced the first chipset in the Genio line called the Genio 1200. It is a chipset designed for AIoT devices such as robot vacuums.

According to Mediatek, the Genio is a “complete platform stack for the AIoT [devices] with powerful and ultra-efficient chipset”. It also has an open platform for software development kits (SDKs) as well as resources and tools to help develop software for AIoT devices. The Mediatek Genio is not just a family of chipsets but also a full-fledged platform that helps manufacturers develop smart applications at entry, mid-range, or premium levels.

Genio allows developers to have full access to the designing and manufacturing of different AIoT devices. Mediatek is already developing several chips under Genio, including the aforementioned Genio 1200 chip, and then uses the company’s development resources and the Yocto Linux Open platform to customise their platform. The entire goal of Genio is to help developers rapidly produce AIoT devices and lessen their costs so that they can be brought to the market fast, while also providing long-term support by providing updates to prolong the life cycle of these devices

Today MediaTek powers the most popular AIoT devices on the market. As the industry enters the next era of innovation, MediaTek’s Genio platform delivers flexibility, scalability and development support brands need to cater to the latest market demands. We look forward to seeing the new user experiences brands bring to life with the Genio 1200 and its powerful AI capability, support for 4K displays and advanced imaging features.

Jerry Yu, Mediatek Corporate Senior Vice President and General Manager of MediaTek’s Computing, Connectivity and Metaverse Business Group. 

The new Mediatek Genio 1200 AIoT chipset features Wi-Fi 6 and Bluetooth 5.2 connectivity, an octa-core CPU comprising of four Cortex A-78 performance cores, and a Mali-G57 MC5 GPU. It is also paired with LPDDR4x-4266 RAM of up to 16GB, Hi-Fi 4 Audio chip, and a dual-core AI processor. The chipset is manufactured on a TSMC 6nm process which makes it power efficient.

In terms of multimedia, it can encode videos of up to 4K@60fps and decode up to 4K@90fps. In terms of its camera, it can take a single 48MP photo or a dual 16+16MP at 30fps using two cameras. It also features facial recognition thanks to its dual-core AI processor.