Mediatek has just released a new set of Wi-Fi 6 and 6E modems under the “Filogic” series. There are two new modems in this series: The Filogic 830 and the 730.
The new Filogic 830 “packs a wide variety of features into a compact, ultra-low power 12nm SoC, allowing customers to design differentiated solutions for routers, access points and mesh systems.” According to this quote, the new Filogic 830 is based on a 12nm architecture powered by four Cortex A-53 processors clocked at 2GHz per core for up to 18,000+ DMIPs processing power. This new 4×4 Wi-Fi 6/6E modem offers up to 6Gbps connectivity and offers two 2.5Gbps ethernet connectivity. According to Mediatek, the Filogic 830’s built-in hardware acceleration offer faster and more reliable Wi-Fi connectivity. In addition to this, the modem also supports Mediatek’s Fastpath for a more seamless experience, such as in VR/AR and gaming.
The Mediatek Filogic 630 is a Wi-Fi 6/6E modem with dual-band support, which means both 2.4GHz and 5GHz Wi-Fi frequencies would be supported. The chipset uses a 2×2 2.4GHz and 3×3 5GHz or 6GHz to make this dual band support possible; this has a connectivity speed of up to 3Gbps. The chipset has a unique feature of supporting 3T3R 5/6GHz system which is significantly faster and provides better connectivity range than the previous 2T2R system. The chipset supports interfaces including PCIe, allowing it to be combined with the Filogic 830 for tri-band connectivity solutions.
In short, these two modem chips promise faster and more reliable connectivity as well as better range, band support and triple-banding.
Source: Mediatek
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